Fischer Elektronik SK508 75 SA, Extruded aluminium heatsink, 75x100x25mm, Rth 3.4 - 1.7 K/W
Fischer Elektronik SK508 75 SA, extruded aluminium heatsink, black anodised surface, dimensions 75x100x25mm, thermal resistance (Rth): 3.4 - 1.7 K/W.
Any electronic device generates heat and with increasing performance the heat development increases. If the heat is not sufficiently dissipated this can lead to an overheating of the device up to a complete system failure. Heatsinks accept the thermal management of electronic devices. Heatsinks are made of good thermal conductive material such as aluminium or copper. They increase the surface over which the device can emit heat. Therefore the temperature can be reduced and an overheating as well as the resultant damages can be efficiently prevented. The effective heat dissipation by means of heatsinks helps to avoid possible system failures.
All Fischer Elektronik heatsinks can be delivered optionally with mounting material. We supply standard devices in different sizes, designs and installation variants. Beginning with profile and fluid heatsinks over fan coolers and finger shaped heatsinks up to heatsinks in round, flat, angled or lamella form. We also have special LED heatsinks for LED operated lights in our range.
On request we can supply special formats according to your individual demand.
Machined heatsinks
- several hundreds of extrusion profiles available
- precise milling treatments in highest quality
- effective heat spreading by means of heatsinks with grouted copper areas
- designs and modifications according to your demand
.
Cooling aggregates
- compact construction for dissipating high power losses on smallest installation space
- heatsink geometries and fixed length optimal adjusted to the fan being used
- homogeneous heat dissipation
- mounting of the semi-conductor by means of sliding nut channels or specific snap-to-retaining springs for transistors
.
Fluid heatsinks
- fluid heatsinks for dissipation of big heat flow volumes
- compact design with internal lamella structure
- thick bottom plates for optimal heat dissipation
- I- and U streamed versions
- water connection or mounting flange for your special application
- customized treatments and solutions
.
Lamella heatsinks
- compact lamella heatsinks with a big surface
- special design for forced convection
- thermotechnical optimal fitted lamellas
- precise milled flat semiconductor mounting surface
- single and double sided bottom plate made of aluminium or copper
- production according to customer specified demands
.
Extruded heatsinks with solder pins
- solid pressed in soldering pins and threaded bolts for a direct pcb-mounting
- for horizontal and vertical mounting position
- standard drilling patterns and transistor retaining springs for various semi-conductive elements
- soldering pins with insulation for spacing help
- variations and modifications according to drawing
- Dimensions (L x l x H)
- 75 x 100 x 25 mm
- Surface finish
- Black anodised
- Thermal resistance (Rth) (K/W)
- 3.4 - 1.7 K/W
1. The prices displayed on the site, including special offers, are valid only for the products in stock, within the available limit!
2. Customized products (eg cables cut to the required length) cannot be refunded and cannot be returned!
3. The images of the products presented on the site are for information purposes only and may differ from the real products!
4. Micronix Plus SRL reserves the right to change the prices and specifications of the products without prior notice.
